Bondloc BMCPU


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Description

BMCPU is suitable for a wide range of internal and external wood applications, it is a single component, solvent free, moisture curing polyurethane adhesive. Specifically designed for bonding wood to wood, for the wood working industry.

Applications

BMCPU can also be used to bond many types of plastic foams and other insulating materials to a wide variety of both rigid and flexible facing materials. Such composites form structural sandwich panels and insulated building boards and may be used in the manufacture of cold stores, caravans, mobile homes and offices, insulated building units.

Properties

  • Pack Size : 1kg
  • Base : Polyurethane
  • Viscosity : @ 25°C 4,400 cps
  • Service Temperature Range : –30°C – +150°C

Downloads

Bondloc BMCPU TDS

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